To provide a solid imaging apparatus, in which seal resin can be easily injected around a solid imaging element.

In the solid imaging apparatus 100, a translucent member 4 is disposed in an opening 10 of a wiring substrate 1 to cover a light receiving part of the solid imaging element 2. The solid imaging element 2 is attached to a back surface of the wiring substrate 1 with a conductive material 5, and it is also sealed to the back surface of the wiring substrate 1 with the seal resin 6 formed around the solid imaging element 2. A through-hole 11 is formed on the wiring substrate 1 to penetrate it in the thickness direction on the outer side of the opening 10 formed on the wiring substrate 1, and the seal resin 6 is filled in the through-hole 11.