Title:
SOLID IMAGING ELEMENT AND ELECTRONIC ENDOSCOPE
Document Type and Number:
Japanese Patent JP2004267593
Kind Code:
A
Abstract:
To secure sufficient strength of a lead connected to a bonding pad disposed in a solid imaging element even if the interval between the bonding pads is narrow.
The solid imaging element has a plurality of pads for bonding the lead on a semiconductor substrate at predetermined intervals. The solid imaging element also has a plurality of layered leads with a first width part wider than the predetermined interval, whose end is formed of a second width part narrower than the predetermined interval. The leads are connected at their respective second width parts to different pads.
Inventors:
TAKIZAWA TSUTOMU
Application Number:
JP2003064655A
Publication Date:
September 30, 2004
Filing Date:
March 11, 2003
Export Citation:
Assignee:
PENTAX CORP
International Classes:
A61B1/04; G02B23/24; H01L21/60; H01L27/14; H04N5/335; (IPC1-7): A61B1/04; H01L21/60; H01L27/14; H04N5/335
Attorney, Agent or Firm:
Shuhei Matsuoka
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