Title:
固相拡散接合方法
Document Type and Number:
Japanese Patent JP7197863
Kind Code:
B2
Abstract:
To provide a method of solid-phase diffusion-joining allowing for favorable joining for even a metal material having a freedom in the shape of a metal material to be joined and a firm oxide film.SOLUTION: A method of solid-phase diffusion-joining has steps of arranging a metal material with its surface-to-be-joined exposed, in a flow passage formed in a jig, ejecting a molten metal of a filler material into the flow passage to generate a droplet of the filler material, allowing a fine particle made of the droplet which is cooled to solidify in the flow passage to hit against a surface-to-be-joined to form a newly generated surface on the surface-to-be-joined, covering, after forming the newly generated surface and before forming an oxide film, the newly generated surface by the molten metal of the filler material, and pressurizing the molten metal in the flow passage while keeping it at a solid-phase diffusion-joining temperature to cause solid-phase diffusion-joining between the newly generated surface and the filler material.SELECTED DRAWING: Figure 6
Inventors:
Imamura Mihaya
Chieko Imai
Toshiaki Kitazawa
Hisaomi Masuzawa
Chieko Imai
Toshiaki Kitazawa
Hisaomi Masuzawa
Application Number:
JP2019111896A
Publication Date:
December 28, 2022
Filing Date:
June 17, 2019
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
MOLE'S ACT Co., Ltd.
MOLE'S ACT Co., Ltd.
International Classes:
B22D19/00; B22D19/04; B22D21/04; B22D27/09
Domestic Patent References:
| JP2004243364A |
Foreign References:
| DE102014014969A1 | ||||
| DE102010015426A1 | ||||
| WO2007051652A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office
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