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Patent Searching and Data


Title:
SOLID PHASE JOINING METHOD
Document Type and Number:
Japanese Patent JPS6277187
Kind Code:
A
Abstract:

PURPOSE: To join firmly both joint surfaces by inter-surface good reactivity and the relaxation of differential thermal expansion, by interposing a composite material of both of them or plural composite materials whose mixing ratio has been changed and executing a solid phase junction, between the joint surfaces of ceramics or a fiber reinforced metallic material and a metallic material.

CONSTITUTION: Between joint surfaces of ceramics 2 or a fiber reinforced metallic material and a metallic material 1, a composite material of both of them, or for instance, a composite material 3 of 20% ceramics and 80% metallic material, and a composite material 4 of 80% ceramics and 20% metallic material are interposed, heated and pressed, and brought to a solid phase junction. The reactivity between the surfaces becomes good, and a difference of a coefficient of thermal expansion is relaxed stepwise, therefore, an inter-surface residual stress is reduced, generation of a crack is prevented, and both the joint surfaces are brought to a solid phase junction firmly.


Inventors:
KOSUGE SHIGECHIKA
KOJIMA TOSHIFUMI
UENO YASUHIRO
WATANABE ITARU
Application Number:
JP21513185A
Publication Date:
April 09, 1987
Filing Date:
September 30, 1985
Export Citation:
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Assignee:
NIPPON KOKAN KK
International Classes:
B23K20/00; C04B37/02; (IPC1-7): B23K20/00; C04B37/02
Domestic Patent References:
JPS6027664A1985-02-12
Attorney, Agent or Firm:
Saburo Kimura (1 outside)