Title:
SOLID SHAPE SOUND AND HEAT INSULATION BOARD
Document Type and Number:
Japanese Patent JP3253798
Kind Code:
B2
Abstract:
PURPOSE: To provide a solid shape sound and heat insulation board excellent in soundproofness, heat insulation and durability.
CONSTITUTION: In a sound and heat insulation board of solid shape such as an exhaust manifold heat insulator 1, the sound and heat insulation board is composed of a metal base plate 12 formed in the solid shape, an inorganic noise absorption material 11 provided on the surface of the metal base plate 12 and a wire gauze 10 arranged on the surface of the inorganic noise absorption material 11 and secured to the metal plate 12 by spot welding, and the inorganic noise absorption material 11 and the wire gauze 10 are integratedly formed. It is desirable that the inorganic noise absorption material is of inorganic fiber.
Inventors:
Koji Fukushima
Application Number:
JP8762394A
Publication Date:
February 04, 2002
Filing Date:
March 31, 1994
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
F01N13/10; C04B32/00; F01N13/14; F02B77/13; (IPC1-7): F02B77/13
Domestic Patent References:
| JP5892424U |
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)