To provide a solid-state image pickup device capable of improving reliability.

This device is provided with a silicon chip 1 provided with a solid-state image pickup element, an optical system (a microlens 2 and a glass substrate 5) provided with the glass substrate 5 for which an opposing surface 5A is arranged at a prescribed distance from the solid-state image pickup element of the silicon chip 1 for entering light into the solid-state image pickup element, a plurality of lead pins 4A arranged between the peripheral edge part (peripheral edge part 1A and side face 1B) of the silicon chip 1 and the opposing surface 5A, electrically connected with the solid-state image pickup element and provided with a bend part 4B on the outer side of the silicon chip 1 and the glass substrate 5 and a soft adhesive material 6 for fixing the silicon chip 1 and the lead pins 4A to the periphery of the opposing surface 5A.