Title:
SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2838816
Kind Code:
B2
Abstract:
PURPOSE: To obtain a high-sensitivity solid-state image pickup device by increasing an aperture ratio.
CONSTITUTION: Photo receiving sections 1 are arranged on a matrix on one surface of a board 10, and vertical CCDs 2a and 2b are provided on each line. Isolating regions 7 and 8 isolating each photoreceiving sections 1 are set to a minimum width by which specified electric characteristics are secured. The wirings 6a and 6b to connect between the first electrodes 3a and 3b of the vertical CCDs and between the second electrodes 4a and 4b are formed on the formation surface of the photoreceiving sections 1 interposing an insulating layer 9. The wirings 6a and 6b and the first and second electrodes 3a, 3b, 4a, and 4b are connected through holes 5 bored in the insulating layer 9 respectively. Incidentally, the wirings 6a, and 6b can be metal of Al, etc., or polysilicon.
Inventors:
ISHIZUYA TOORU
Application Number:
JP18824491A
Publication Date:
December 16, 1998
Filing Date:
July 03, 1991
Export Citation:
Assignee:
NIKON KK
International Classes:
H01L27/148; H04N5/335; H04N5/369; H04N5/372; (IPC1-7): H01L27/148; H04N5/335
Domestic Patent References:
| JP2296368A |
Attorney, Agent or Firm:
Yoshio Inoue