Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLID STATE IMAGE PICKUP DEVICE
Document Type and Number:
Japanese Patent JPS6113777
Kind Code:
A
Abstract:

PURPOSE: To obtain a solid state camera having a high S/N by using a light emitting element which modulates the light according to the level of an amplified signal to extract the signal of a solid state image pickup element and reducing the effects of noises due to the capacitive connection to a pulse generating circuit, or the external electromagnetic induction, etc.

CONSTITUTION: A faint image pickup signal delivered from an image pickup device 1 is supplied to an LED8 via a signal output bonding pad 2a, a bonding wire 10 and a bonding wire 9. Then the image pickup signal modulates the optical signal output of an LED incorporated to the LED8. The optical signal is propagated within an optical fiber 11 and taken out of a package 20 and undergoes the photoelectric conversion through a photodetector 12. Then the optical signal is delivered through a terminal 13. Thus the connection between the device 1 and an amplifier of the first stage is possible directly by means of a bonding wire 10 within a cavity 3 with no exposure to outside. This decreases the length of a connection line and improves greatly an S/N.


Inventors:
NISHIZAWA SHIGEKI
TAKEMOTO KAYAO
Application Number:
JP13310484A
Publication Date:
January 22, 1986
Filing Date:
June 29, 1984
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
International Classes:
H01L27/14; H04N5/335; H04N5/357; H04N5/376; (IPC1-7): H01L27/14
Attorney, Agent or Firm:
Akio Takahashi