To provide a support structure of a solid-state image pickup element that reduces costs and at the same time improves yields by allowing the support structure to be accurately mounted to circuit components, at the same time does not cause quality from deteriorating after production, accurately positions a line that is formed by an image-forming lens by position adjustment that is made before adhesion fixation, reads optical characteristics (focus, magnification) with specific required accuracy, and finely moves the solid-state image pickup element in the direction of five axes of X, Y, Z, β and γ for adjusting positions.

The solid-state image pickup element has a semiconductor chip 3 for imaging having at least one photoelectric conversion element line, and a package 2 for accommodating the semiconductor chip inside. The package has an insulating package body 2 for mounting a semiconductor chip on a flat inner bottom surface at a recess, transparent cover glass 15 that is fixed on the upper surface of an outer frame at the recess for sealing the recess, and a lead frame that is withdrawn to the outside of the package body. In the solid-state image pickup element, a reference plane P for mounting to an image-reading apparatus is made in parallel with an inner bottom surface 30 at the recess for mounting the semiconductor chip.