Title:
SOLID-STATE IMAGE PICKUP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2005065285
Kind Code:
A
Abstract:
To provide a solid-state image pickup semiconductor device of which the thickness is reduced, of which the size is made small, and of which the cost is reduced in comparison with a conventional techniques.
An opening 375 is formed on a circuit board 300 and a solid-state image pickup semiconductor chip 350 or an image processing semiconductor chip 320 is located within the opening 375, thereby providing the solid-state image pickup semiconductor device of which the thickness is reduced, and a packaging area is also reduced.
Inventors:
RO YOUNG-HOON
KEN NEISHIN
MOK SEUNG-KON
KEN NEISHIN
MOK SEUNG-KON
Application Number:
JP2004234797A
Publication Date:
March 10, 2005
Filing Date:
August 11, 2004
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L27/14; H01L23/00; H01L27/146; H04N5/225; H04N5/335; (IPC1-7): H04N5/335; H01L27/14; H04N5/225
Domestic Patent References:
| JP2002252797A | 2002-09-06 | |||
| JP2001078064A | 2001-03-23 | |||
| JP2001345391A | 2001-12-14 | |||
| JP2001292354A | 2001-10-19 | |||
| JPH089272A | 1996-01-12 |
Attorney, Agent or Firm:
Mikio Hatta
Yasuo Nara
Etsuko Saito
Katsuyuki Utani
Toshifumi Fujii
Yasuo Nara
Etsuko Saito
Katsuyuki Utani
Toshifumi Fujii