Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP3582634
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solid state image sensor in which the reliability is enhanced by eliminating the effect of flux at the time of mounting a slid state image sensing element chip on a printed wiring board. SOLUTION: A printed wiring board 21 mounting an electronic device 22 is mounted, on one side thereof, with a solid state image sensor element chip 24 and, on the other side thereof, with an image sensing optical system 26. At the time of mounting the solid state image sensor element chip 24 on the printed wiring board 21, an opening 21a made in the printed wiring board 21 is aligned with the light receiving face 24a of the solid state image sensor element chip 24 and a plurality of gold plated pads arranged in the vicinity of the opening 21a are bonded to gold bumps on the solid state image sensor element chip 24.
More Like This:
Inventors:
Yoshio Adachi
Saku Sasaki
Bunichi Harazono
Takanao Suzuki
Noboru Takada
Hiroyuki Otani
Nishida alone
Kazushi Higashi
Saku Sasaki
Bunichi Harazono
Takanao Suzuki
Noboru Takada
Hiroyuki Otani
Nishida alone
Kazushi Higashi
Application Number:
JP19886698A
Publication Date:
October 27, 2004
Filing Date:
July 14, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L27/14; H04N5/335; H04N5/372; H04N5/374; (IPC1-7): H01L27/14; H04N5/335
Domestic Patent References:
| JP3018343A | ||||
| JP9102896A | ||||
| JP8084278A | ||||
| JP9092683A | ||||
| JP8162491A | ||||
| JP9153525A | ||||
| JP9064103A |
Attorney, Agent or Firm:
Mitsutake Murayama