Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP4270455
Kind Code:
B2
Abstract:
A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.
Inventors:
Tsuneo Sato
Atsuhiko Ishihara
Akihiro Uchida
Koji Souda
Masahiro Kato
Shigeru Kondo
Atsuhiko Ishihara
Akihiro Uchida
Koji Souda
Masahiro Kato
Shigeru Kondo
Application Number:
JP2004093630A
Publication Date:
June 03, 2009
Filing Date:
March 26, 2004
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01J40/14; H01L27/146; H04N5/225; H04N5/335; H01L23/49; H01L23/552
Domestic Patent References:
| JP2004179539A | ||||
| JP2003101042A | ||||
| JP5056916A | ||||
| JP2002094035A | ||||
| JP9329499A | ||||
| JP2003168792A |
Attorney, Agent or Firm:
Kazunori Kobayashi
Shigeru Iijima
Kobayashi Hideyoshi
Shigeru Iijima
Kobayashi Hideyoshi