Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP5025746
Kind Code:
B2
Abstract:
According to one embodiment, a solid-state imaging device includes a photodiode module in which first photodiodes corresponding to high-sensitivity pixels and second photodiodes corresponding to low-sensitivity pixels are alternately arranged at preset pitch P in a semiconductor substrate, high-sensitivity pixel interconnection lines formed at preset pitch C on the substrate, low-sensitivity pixel interconnection lines that are formed at preset pitch D on the substrate, high-sensitivity pixel color filters formed at preset pitch A on the opposite side of the respective interconnection lines with respect to the substrate, and low-sensitivity pixel interconnection lines that are formed at preset pitch B on the other side of the interconnection lines with respect to the substrate. The relationship between the above pitches is set to D=B

Inventors:
Naruse Junji
Nagataka Tanaka
Application Number:
JP2010064742A
Publication Date:
September 12, 2012
Filing Date:
March 19, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toshiba Corporation
International Classes:
H04N5/374; H01L27/14; H01L27/146; H04N5/355
Domestic Patent References:
JP2008311681A
JP2008099073A
JP2006270356A
JP2007116437A
JP2002199284A
JP2007281875A
JP2007242721A
JP2007287891A
JP2007135200A
JP2007208817A
JP2004221532A
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen