Title:
固体撮像装置および撮像装置
Document Type and Number:
Japanese Patent JP6457738
Kind Code:
B2
Abstract:
A solid-state image pickup device includes: a first substrate which has a pixel part divided into a plurality of groups obtained by dividing a plurality of pixels arranged in a two-dimensional matrix into groups corresponding to each of a plurality of predetermined rows; and a second substrate including a pixel load current source corresponding to a vertical signal line to which the plurality of pixels disposed in the same column within the groups are connected, a column circuit that performs a predetermined process on a pixel signal which is output from the pixel to a corresponding vertical signal line, and a pixel for correction that outputs a pixel signal for correction for correcting the corresponding column circuit to the vertical signal line to which the corresponding column circuit is connected, for each column of the pixels belonging to the group.
Inventors:
Toru Kondo
Application Number:
JP2014095478A
Publication Date:
January 23, 2019
Filing Date:
May 02, 2014
Export Citation:
Assignee:
Olympus Endo Technology America Inc.
International Classes:
H04N5/3745; H01L27/146
Domestic Patent References:
| JP2011135194A | ||||
| JP2012257095A | ||||
| JP2007228460A |
Foreign References:
| WO2014007004A1 | ||||
| WO2013041924A1 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Tadao Takashiba
Shiro Suzuki
Hiroyuki Hashimoto
Masatake Shiga
Suzuki Mitsuyoshi
Tadao Takashiba
Shiro Suzuki
Hiroyuki Hashimoto