SOLID-STATE IMAGING APPARATUS AND METHOD OF MANUFACTURING SAME

Title:

SOLID-STATE IMAGING APPARATUS AND METHOD OF MANUFACTURING SAME

Document Type and Number:

Japanese Patent JP2007194930

Kind Code:

A

Abstract:

To provide a solid-state imaging apparatus which can be made compact and provide improved productivity, and to provide a method of manufacturing the same.

The solid-state imaging apparatus has a solid structure on which a solid-state imaging device and a translucent member are mounted. The structure is made of insulative resin and has: a through opening; a solid-state imaging device mount part which mounts the solid-state imaging device on an opening surface that a light reception surface of the solid-state imaging device faces; and a step part which mounts the translucent member on an edge of the opening surface, wherein the light reception surface and translucent member are mounted at a prescribed interval so as to close the through opening.

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Inventors:

HARAZONO BUNICHI
NAKAGIRI YASUSHI
SUGAWARA TAKESHI

Application Number:

JP2006011383A

Publication Date:

August 02, 2007

Filing Date:

January 19, 2006

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H04N5/225; H04N5/335

Attorney, Agent or Firm:

Takeshi Takamatsu
Toshimitsu Ichikawa
Kimihide Hashimoto

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