Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2021072295
Kind Code:
A
Abstract:
To improve photoelectric conversion efficiency.SOLUTION: A solid-state imaging comprises: a photoelectric conversion unit provided on a semiconductor substrate; a first insulation film positioned on an incidence surface side of light to the photoelectric conversion unit relative to the semiconductor substrate; and an uneven structure positioned between the photoelectric conversion unit and the first insulation film; and the uneven structure is positioned on the photoelectric conversion unit side, and comprises a first layer which diffracts light incident on the photoelectric conversion unit; and a second layer which is positioned on the first insulation film side and suppresses reflection toward the first insulation film side.SELECTED DRAWING: Figure 6
Inventors:
TAKEUCHI KOICHI
Application Number:
JP2019195805A
Publication Date:
May 06, 2021
Filing Date:
October 29, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
H01L27/146; G02B5/20; H04N5/369
Attorney, Agent or Firm:
Sakai International Patent Office