To enhance the reliability and manufacture yield of a solid state imaging device.
On the surface 2a of a wiring board 2, a sensor chip 3 and a lens-barrel 4 for containing the sensor chip 3 are mounted, and the lens-barrel 4 is coupled with a lens holder 5 for holding a lens 6 internally. On the rear surface 2b of the wiring board 2, a logic chip 7, a memory chip 8 and a passive component 9 are mounted and sealed with sealing resin 10. The lens-barrel 4 and the lens holder 5 are screw fitted and heat welded. The passive component 9 is bonded to the wiring board 2 by Sn-Ag based lead-free solder. The wiring board 2 is subjected to plasma cleaning, the sensor chip 3 is mounted on the wiring board 2 and then the electrode pad 3a of the sensor chip 3 is connected electrically with the electrode 12 on the wiring board 2 through a bonding wire 11.
NAKANISHI MASAKI
SHIGEMURA KUNIO
NISHI TAKAOMI
SHIDA KOJI
TEZUKA IZUMI
ABE SHUNICHI
TOMITA YOSHIHIRO
KIYONO MITSUAKI
KOMATSU SATORU
RENESAS E JP SEMICONDUCTOR INC