Title:
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2021097189
Kind Code:
A
Abstract:
To provide a solid-state imaging device capable of minimizing a reduction in image quality due to a trench between lenses, and a method for manufacturing such a solid-state imaging device.SOLUTION: A solid-state imaging device according to the present invention includes multiple photoelectric conversion units and multiple lenses provided above the multiple photoelectric conversion units. The multiple lenses have a trench provided between the lenses. The trench has a bottom surface having a downward-projecting shape.SELECTED DRAWING: Figure 4
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Inventors:
MORIYA YUSUKE
Application Number:
JP2019229355A
Publication Date:
June 24, 2021
Filing Date:
December 19, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
H01L27/146; G02B1/11; G02B5/20; H04N5/359; H04N5/369
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Yukitaka Nakamura
Satoru Asakura