Title:
SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2022023664
Kind Code:
A
Abstract:
To provide a solid-state imaging device of a configuration comprising an image sensor and a mold resin portion formed around a cover glass, the configuration requiring no dedicated molding die and preventing generation of resin burrs due to the mold resin on the cover glass surface; a method for manufacturing the solid-state imaging device; and an electronic apparatus.SOLUTION: The solid-state imaging device comprises: a substrate; an image sensor provided on the substrate; a transparent member provided over the image sensor with a support portion therebetween; and a mold resin portion formed around the image sensor and the transparent member on the substrate. A groove is formed at a front surface side of the transparent member in a portion outside a light-receiving region of the image sensor.SELECTED DRAWING: Figure 2
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Inventors:
OTSUKA YASUSHI
Application Number:
JP2020126759A
Publication Date:
February 08, 2022
Filing Date:
July 27, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
H01L27/146; H01L23/02; H01L23/28; H01L23/29; H04N5/335
Attorney, Agent or Firm:
Kenichiro Matsuo
Yasuo Ichikawa
Yasuo Ichikawa