Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
Japanese Patent JP2008193565
Kind Code:
A
Abstract:
To provide a solid-state imaging device wherein a solid-state imaging element and a prism are bonded, which can solve the problem caused by bonding the solid-state imaging element and the prism with an adhesive and suppress reduction in precision of registration.
In a bonding structure of a solid-state imaging element and a prism, a decompressed space forming part for forming a decompressed space where the pressure is reduced lower than the ambient atmosphere is arranged in the bonding part of the solid-state imaging element and the prism. By the pressure of the decompressed space, the solid-state imaging element and the prism are bonded, thus obtaining a bonding structure without using an adhesive.
Inventors:
NYURAIIN MIYOKO
IWATA YUKIHIRO
OGASAWARA SHINYA
IWATA YUKIHIRO
OGASAWARA SHINYA
Application Number:
JP2007027829A
Publication Date:
August 21, 2008
Filing Date:
February 07, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H04N9/09; H04N5/225
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mitsuo Wada
Hiroshi Okabe
Mitsuo Tanaka
Mitsuo Wada
Hiroshi Okabe