Title:
SOLID STATE IMAGING DEVICE
Document Type and Number:
Japanese Patent JP3838573
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solid state imaging device in which the occurrence of distortion due to an imaging element extending along the surface of a substrate is suppressed even when the imaging element is bonded to the surface of a substrate having insufficient flatness, and an influence of distortion on the electric characteristics or the like is lessened.
SOLUTION: The solid state imaging device comprises a substrate 2, a frame-like rib 3 arranged on the substrate to form an inner space, a plurality of wiring members 9 electrically led out of the inner space of a housing 1 formed by the substrate and the rib, an imaging element 5 bonded to a wiring board in the inner space, a translucent plate 7 bonded to the upper end face of the rib, and a thin metal wire 10 for connecting the electrode of the imaging element and each wiring member. A plurality of hemispheric protrusions 2a are formed in a region of the substrate facing the imaging element which is bonded to the substrate with an adhesive 6 while being supported by the protrusions.
Inventors:
Katsutoshi Shimizu
Koichi Yamauchi
Masanori Minamio
Koichi Yamauchi
Masanori Minamio
Application Number:
JP2003363609A
Publication Date:
October 25, 2006
Filing Date:
October 23, 2003
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/02; H01L27/14; H01L23/04; H01L23/08; H01L23/50; H01L27/146; H01L31/0203; H04N5/335; H04N5/372; (IPC1-7): H01L23/02; H01L23/04; H01L23/08; H01L23/50; H01L27/14; H04N5/335
Domestic Patent References:
| JP2001244280A | ||||
| JP2004200629A |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners
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