Title:
固体撮像装置および撮像装置
Document Type and Number:
Japanese Patent JP7278209
Kind Code:
B2
Abstract:
A solid-state image capture device includes a first semiconductor substrate and a second semiconductor substrate. The first semiconductor substrate includes a first connection and a pixel array in which a plurality of pixels are arranged in a matrix. The second semiconductor substrate includes a second connection and a pad area including a plurality of pad electrodes for electrical connection with external equipment. The second semiconductor substrate controls the pixel array. The first and second semiconductor substrates are stacked and joined together, with the first and second connections electrically connected to each other. The first and second semiconductor substrates are substantially equal in size, and the pad electrodes are included in only the second semiconductor substrate.
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Inventors:
Yusuke Shimizu
Kazutoshi Onozawa
Kazutoshi Onozawa
Application Number:
JP2019514374A
Publication Date:
May 19, 2023
Filing Date:
April 12, 2018
Export Citation:
Assignee:
Nuvoton Technology Japan Co., Ltd.
International Classes:
H01L27/146; H04N25/70; H04N25/76; H04N25/78
Domestic Patent References:
| JP2017034052A | ||||
| JP2015185769A | ||||
| JP11074494A |
Foreign References:
| WO2016185901A1 | ||||
| WO2016129138A1 |
Attorney, Agent or Firm:
Hiromori Arai
Eisaku Teratani
Shinichi Michisaka
Eisaku Teratani
Shinichi Michisaka