Title:
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2018088532
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the sensitivity to light on the longer wavelength side.SOLUTION: A substrate has a first surface that is a light incident surface side and a second surface that is opposed to the first surface, and an uneven pattern is provided on the first surface of the substrate, and an element isolation structure is provided between adjacent pixels disposed on the substrate. The uneven pattern has a structure in which a concave structure having a quadrangular pyramid shape is periodically formed with respect to the first surface of the substrate in plan view. The present disclosure can be applied to, for example, a CMOS or the like that detects light in an infrared band.SELECTED DRAWING: Figure 1
Inventors:
YOKOKAWA SOZO
Application Number:
JP2017253205A
Publication Date:
June 07, 2018
Filing Date:
December 28, 2017
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L27/146; H04N5/33; H04N5/369
Domestic Patent References:
| JP2016001633A | 2016-01-07 | |||
| JP2013033864A | 2013-02-14 | |||
| JP2006216841A | 2006-08-17 | |||
| JP2006261372A | 2006-09-28 | |||
| JP2012169530A | 2012-09-06 | |||
| JP2009088030A | 2009-04-23 |
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yoshio Inamoto