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Title:
SOLID WOOD SOUND INSULATING FLOOR MATERIAL
Document Type and Number:
Japanese Patent JP2010071000
Kind Code:
A
Abstract:

To provide a solid wood sound insulating floor material having superior sound insulating properties and directly joinable to concrete.

This sound insulating floor material includes a long plate-like solid wood base and a damping material layer provided to the rear surface of the solid wood base through an adhesive agent layer. A plurality of vertical grooves positioned parallel to the longitudinal direction thereof along the veins and a plurality of horizonal grooves orthogonal to the vertical grooves are formed on the rear surface of the solid wood base at predetermined intervals.


Inventors:
Yamazaki, Yasuhiro
Application Number:
JP2008000240859
Publication Date:
April 02, 2010
Filing Date:
September 19, 2008
Export Citation:
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Assignee:
MATSUBARA SANGYO KK
International Classes:
E04F15/04; E04F15/02; E04F15/18
Domestic Patent References:
JP2001295453A
JP2001107543A
Attorney, Agent or Firm:
大家 邦久
林 篤史



 
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