Title:
SOLUBLE ALLOY FOR TEMPERATURE FUSE, WIRE ROD FOR TEMPERATURE FUSE, AND TEMPERATURE FUSE
Document Type and Number:
Japanese Patent JP3771512
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a lead-free soluble alloy for a temperature fuse which is rapidly fused in any desired temperature included in the temperature range from 60 to 140°C, to provide a wire rod for a temperature fuse consisting of the soluble alloy, and to provide a temperature fuse having a temperature fuse element consisting of the wire rod.
SOLUTION: The soluble alloy for a temperature fuse contains, by mass, 50 to 60% bismuth, 0.1 to 45% indium and 0.1 to 5% copper, and the balance tin with inevitable impurities. The wire rod for a temperature fuse is formed of the soluble alloy for a temperature fuse. The temperature fuse element used for a temperature fuse is formed of the above wire rod for a temperature fuse.
Inventors:
Hara, Shiro
Sugiura, Masahiro
Kubota, Toshihiro
Kato, Shinichi
Katsumoto, Noriyuki
Sugiura, Masahiro
Kubota, Toshihiro
Kato, Shinichi
Katsumoto, Noriyuki
Application Number:
JP2002000101448
Publication Date:
February 17, 2006
Filing Date:
April 03, 2002
Export Citation:
Assignee:
SORUDAA KOOTO KK
ANZEN DENGU KK
ANZEN DENGU KK
International Classes:
C22C12/00; H01H37/76; (IPC1-7): C22C12/00; H01H37/76