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Title:
SOLVENT CARRIER SHEET, SHEET WATERPROOFING STRUCTURE, AND ADHESION METHOD
Document Type and Number:
Japanese Patent JP2016069804
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a solvent carrier sheet capable of supplying a soluble solvent uniformly to a connected portion between first and second resin layers overlapped in a thickness direction of a sheet waterproofing structure for waterproofing a building frame, and firmly connecting the connected portion, when fusing the resin layers using the soluble solvent, along with the sheet waterproofing structure installed using the solvent carrier sheet, and an adhesion method applied to installation of the sheet waterproofing structure that uses the solvent carrier sheet.SOLUTION: A solvent carrier sheet 80 is used in an adhesion method in which a waterproof sheet (first resin layer) 20 and a resin layer (second resin layer) 62 of a sheet waterproofing structure 10 are fused using a soluble solvent at a connected portion 64. The solvent carrier sheet includes a fiber assembly containing a first and second fibers, and is disposed between the waterproof sheet 20 and the resin layer 62 at the connected portion 64 with the fiber assembly carrying the soluble solvent. When the fiber assembly is pressed, the soluble solvent seeps out therebetween.SELECTED DRAWING: Figure 2

Inventors:
IKEDA HIROKAZU
Application Number:
JP2014196795A
Publication Date:
May 09, 2016
Filing Date:
September 26, 2014
Export Citation:
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Assignee:
S B SHEET WATERPROOF SYS CO LTD
International Classes:
E04D5/14
Domestic Patent References:
JPS62170648A1987-07-27
JPS60184157A1985-09-19
JPS5331324A1978-03-24
JP2005146774A2005-06-09
JP2013133690A2013-07-08
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi