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Title:
無溶剤型ラミネート接着剤、その硬化物、積層体及び包装体
Document Type and Number:
Japanese Patent JP7003572
Kind Code:
B2
Abstract:
To provide a solventless type laminate adhesive which is excellent in laminate adhesive strength, in particular, in laminate adhesive strength after boil treatment as an adhesive suitable for non-isocyanate soft packaging laminate, and a laminate film using the same.SOLUTION: There are provided a solventless type laminate adhesive which contains a polyamine resin (A) having a primary amino group in the molecular structure, and polyglycidyl ether (B1) of linear aliphatic polyol as a polyfunctional epoxy compound (B), as an essential component; a cured product obtained by curing the solventless type laminate adhesive; a laminate using the solventless type laminate adhesive as an adhesive layer; and a package. Preferably, the polyamine resin (A) having the primary amino group in the molecule structure is preferably a polyurethane polyurea resin (A1), a polyamide resin (A2) or a polyether amine resin (A3).SELECTED DRAWING: None

Inventors:
Ryuji Kimura
Shinichi Ohara
Iwanami Hideoki
Kenichi Shimamura
Application Number:
JP2017208158A
Publication Date:
January 20, 2022
Filing Date:
October 27, 2017
Export Citation:
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Assignee:
DIC Corporation
International Classes:
C09J163/00; B32B27/34; B32B27/38; B32B27/40; C08G18/66; C08G59/20; C08G59/50; C09J175/00; C09J179/02
Domestic Patent References:
JP2011162649A
JP5202162A
JP2002302591A
Foreign References:
WO2014007119A1
WO2017163900A1
Attorney, Agent or Firm:
Ogawa Shinji
Akihiro Iwamoto
Takayuki Ohno