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Patent Searching and Data


Title:
SOLVENT-FREE SYNTHETIC RESIN AQUEOUS DISPERSION
Document Type and Number:
Japanese Patent JPH07149872
Kind Code:
A
Abstract:

PURPOSE: To prepare a solvent-free synthetic resin aqueous dispersion useful as a binder and the like, which is able to yield a film having excellent durability and a solvent resistance by mixing a mixture of an ionic resin and an ethylenically unsaturated monomer with a specific type of polyisocyanate, and polymerizing the mixture under specific conditions.

CONSTITUTION: A mixture of an ionic resin, such as an amino-epoxy resin or the like, and at least one ethylenically unsaturated monomer, such as hydroxypropyl (meth)acrylate or the like, is mixed with a completely blocked polyisocyanate, such as phenylene diisocyanate or the like, wherein some of blocking groups contain an ethylenically unsaturated group, and is converted to an aqueous dispersion, followed by polymerization of all of the ethylenically unsaturated groups by emulsion polymerization to obtain the objective solvent- free synthetic resin aqueous dispersion. It is pref. that the dispersion should be used as a binder in a lead-free cationic electrodeposition bath.


Inventors:
MITSUHIYAERU HENERU
MARUKUSU AA SHIYATSUFUHOITORE
AHIMU FUERUKERU
GERUTO UARUTSU
SUUZANEN UEENAA
PEETAA TSUIIGURERU
Application Number:
JP21761094A
Publication Date:
June 13, 1995
Filing Date:
September 12, 1994
Export Citation:
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Assignee:
HOECHST AG
International Classes:
C08F2/16; C08F2/24; C08F2/44; C08G18/00; C08G18/08; C08G18/58; C08G18/64; C08G18/72; C08G18/80; C08L63/00; C08L63/10; C09D5/02; C09D5/44; C09D163/00; C09D175/04; (IPC1-7): C08G18/80; C08G18/08
Attorney, Agent or Firm:
Mitsufumi Ezaki (3 others)