Title:
Solvent soluble polyimide resin
Document Type and Number:
Japanese Patent JP6262691
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solvent-soluble polyimide resin capable of forming an adhesive layer which does not generate a volatile component formed of a cyclic siloxane compound and does not lower an adhesive force between a wiring layer and a coverlay film even in the use environment exposed to a high temperature repeatedly.SOLUTION: A solvent-soluble polyimide resin is obtained by reacting an acid anhydride component which has a weight average molecular weight of 10,000-200,000 and includes an aromatic tetracarboxylic acid anhydride with a diamine component including aliphatic diamine. The diamine component which is a raw material of the solvent-soluble polyimide resin includes aliphatic diamine derived from a dimer acid having 24-48 carbon atoms, and may further include aromatic diamine. The solvent-soluble polyimide resin preferably does not include a siloxane compound as a raw material.
Inventors:
Tetsuya Nakanishi
Ryo Mori
Yoshiki Sudo
Ryo Mori
Yoshiki Sudo
Application Number:
JP2015136816A
Publication Date:
January 17, 2018
Filing Date:
July 08, 2015
Export Citation:
Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
C08G73/10; C09J7/20; C09J179/08
Domestic Patent References:
| JP20131730A | ||||
| JP2011256372A | ||||
| JP2010163489A | ||||
| JP20106983A | ||||
| JP2012180471A |
Foreign References:
| WO2007116979A1 |
Attorney, Agent or Firm:
Kazuhiro Watanabe