Title:
SOLVENTLESS SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017222745
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a solventless silicone-modified polyimide resin composition which is preferred as an adhesive and a coating agent that can be cured with ultraviolet rays and/or visible light rays, and in which liquid sagging is prevented by low filling of an inorganic compound filler, the entry of bubbles and nonuniformity due to high filling of a filler in application are prevented, thixotropy with maintained moldability is further exhibited, adhesiveness to a polyolefin resin is improved without inhibiting conventional performance, the increased hardness of a cured product due to filling of an inorganic compound filler is inhibited, and a low elastic modulus is exhibited.SOLUTION: The solventless silicone-modified polyimide resin composition contains the following (A) to (E) components: (A) silicone-modified polyimide resin, (B) polymerizable compound, (C) polymerization initiator, (D) hydrophobic fumed silica gel, and (E) adhesive aid, has flowability at 25°C, and includes no solvent.SELECTED DRAWING: Figure 1
Inventors:
HATTORI HATSUHIKO
YONEDA YOSHIAKI
KANAI TOMOYA
YONEDA YOSHIAKI
KANAI TOMOYA
Application Number:
JP2016117586A
Publication Date:
December 21, 2017
Filing Date:
June 14, 2016
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08F2/44; C09D4/00; C09D4/02; C09D7/41; C09D7/47; C09D7/61; C09D179/08; C09J4/00; C09J4/02; C09J11/04; C09J11/06; C09J179/08
Attorney, Agent or Firm:
Hideaki International Patent Office
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