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Patent Searching and Data


Title:
SOUND-ABSORBING MEMBER USING RUBBER CHIP AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2000006282
Kind Code:
A
Abstract:

To provide a sound-absorbing member using rubber chips in which waste tires are used and which can be manufactured easily at a low cost and further, displays high sound-absorbing effects stably even when it is thin, and provide also a manufacturing method thereof.

Rubber chips 4, 5 obtained by crushing waste tires are laminated by each specified thickness by changing the grain size. The rubber chips 4, 5 are laminated by each specified thickness from great grain size to small. The rubber chips 4, 5 are laminated in each-specified thickness while being bonded, solidified by vulcanization instead of by adhesion and further, the rubber chip material is mixed with an adhesive and a colorant as required to be laminated in such a manner that the grain size varies. The rubber chip material is laminated without adding the adhesive and is poured into a form and then vulcanized and dried.


Inventors:
KUMAMARU KOJI
Application Number:
JP18981598A
Publication Date:
January 11, 2000
Filing Date:
June 19, 1998
Export Citation:
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Assignee:
PRESS KOGYO KK
International Classes:
E01F8/00; B29B13/10; B29B17/00; B29B17/04; B32B5/14; B32B5/16; C08J3/20; C08J3/24; E01F8/02; B29K21/00; B29K105/26; (IPC1-7): B32B5/16; B29B13/10; B29B17/00; B32B5/14; C08J3/20; C08J3/24; E01F8/00; E01F8/02
Attorney, Agent or Firm:
Eiichi Shiihara