Title:
音減衰パッチ
Document Type and Number:
Japanese Patent JP5722999
Kind Code:
B2
Abstract:
A panel assembly for use in any number of different applications, including a variety of vehicle applications, that reduces noise or vibrations, provides thermal insulation, and/or improves structural integrity. According to an exemplary embodiment, the panel assembly includes a main panel made from a metal, one or more sound damping patches also made from a metal, and an adhesive layer that joins the patches to the main panel in a constrained layer construction. The sound damping patches may include one or more forming features, which are designed to improve the formability of the panel assembly without significantly impairing its sound damping characteristics. There are different types of forming features, including internal forming features (e.g., openings, holes, slits, slots, etc.) located within the interior of the patch and external forming features (e.g., projections, fingers, recesses, waveforms, etc.) located along the perimeter of the patch.
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Inventors:
Fetco, Stephen, A.
Keys, James, F.
Fisk, Jonathan, W.
Andel, Paul, A.
Maurice, Chris
Keys, James, F.
Fisk, Jonathan, W.
Andel, Paul, A.
Maurice, Chris
Application Number:
JP2013515401A
Publication Date:
May 27, 2015
Filing Date:
June 10, 2011
Export Citation:
Assignee:
Shiro Industries Incorporated
International Classes:
G10K11/16; B60R13/08; B62D25/06; B62D25/08; B62D25/18; B62D25/20
Domestic Patent References:
| JP6510703A | ||||
| JP6154895A | ||||
| JP52039859B1 | ||||
| JP2007276295A | ||||
| JP2206544A |
Attorney, Agent or Firm:
Hideo Takino
Takao Kawasaki
Fumio Takino
Toshiaki Tsuda
Masashi Torino
Takao Kawasaki
Fumio Takino
Toshiaki Tsuda
Masashi Torino