Title:
SOUND-INSULATING FLOOR STRUCTURE FOR BUILDING CONSTRUCTION
Document Type and Number:
Japanese Patent JPH11324297
Kind Code:
A
Abstract:
To provide a sound-insulating floor structure for construction, in which sound-insulating performance to a lightweight impact sound can be improved extremely without deteriorating a feeling of walking.
A floor bed material 4 consisting of the laminate of a soft synthetic-resin foamed board 7 having a dynamic spring constant from 1×106 N/m3 to 10×106 N/m3 and a semirigid synthetic-resin foamed board 8 is installed onto a concrete slab 2 under the state, in which a levelling material 3 is interposed, and an under-layment material 5 and a flooring material 6 are laid on the floor bed material 4 in a laminated shape.
Inventors:
MATSUYOSHI HIROYOSHI
KOMURA MICHIO
MATSUMURA YOSHIO
KOMURA MICHIO
MATSUMURA YOSHIO
Application Number:
JP12864798A
Publication Date:
November 26, 1999
Filing Date:
May 12, 1998
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
E04B1/82; B32B5/18; B32B13/12; E04F15/18; E04F15/20; (IPC1-7): E04F15/20; B32B5/18; B32B13/12; E04B1/82; E04F15/18
Attorney, Agent or Firm:
Takao Yanagino
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