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Patent Searching and Data


Title:
SOUND INSULATION STRUCTURE AND METHOD OF ASSEMBLING THE SAME
Document Type and Number:
Japanese Patent JPH04302659
Kind Code:
A
Abstract:

PURPOSE: To simplify the setting of several rubber cushion members and to reduce noise caused of spatial propagation sound.

CONSTITUTION: A sound insulation floor structure of a double floor type in which floor panels 5 are laid separating away from a floor surface 2 which is finished with mortar or the like, there are provided a plurality of split sound absorbing sheets 3, a plurality of resilient support legs 4 provided on the upper surface of each of the sheet 3, and the split floor panels 5 coupled to the sheets 3 through the intermediary of the legs 4. Further, in a method of assembling a sound insulation floor in which floor panels 5 are laid being separated from a floor surface 2 finished with mortar, a plurality of sound absorbing sheets 3 to which a plurality of resilient support legs 4 are coupled are laid on the floor surface 2, and the joint between the resilient support legs 4 on the sound absorbing sheets 3 and the floor panels 5 are carried out in a batch for every sheet 3.


Inventors:
MASUOKA NOBUO
TABIIE TADAYOSHI
TATSUMI KIMIO
Application Number:
JP6701991A
Publication Date:
October 26, 1992
Filing Date:
March 29, 1991
Export Citation:
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Assignee:
HITACHI RUBBER KAKO KK
HITACHI CABLE
TOLI CORP LTD
International Classes:
E04F15/024; E04F15/18; (IPC1-7): E04F15/024; E04F15/18
Attorney, Agent or Firm:
Nobuo Kinutani