Title:
SOUND PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2003102097
Kind Code:
A
Abstract:
To provide a sound processing apparatus at a low cost with uniformized characteristics and enhanced reliability while attaining downsizing/ weight reduction and mass-productivity of a sound input section.
A chip microphone 10 with a layered structure by a semiconductor manufacturing technology and comprising a diaphragm 12 vibrated by a sound pressure, a rear plate 14 facing the diaphragm 12, and a joining support 13 joining the diaphragm 12 and the rear plate 14 to ensure a vibration space S of the diaphragm 12 and whose major component is silicon oxide powder is mounted on a sound recording device for performing recording processing of recording sound information such as picked up voice to a recording section 25.
Inventors:
SAITO NOBUO
NISHIGUCHI TOSHIYUKI
TAJIMA TOSHIFUMI
NISHIGUCHI TOSHIYUKI
TAJIMA TOSHIFUMI
Application Number:
JP2001291824A
Publication Date:
April 04, 2003
Filing Date:
September 25, 2001
Export Citation:
Assignee:
JAPAN BROADCASTING CORP
International Classes:
C09J1/00; C09J11/04; C09J201/00; H04R1/04; H04R1/40; H04R19/04; H04R31/00; (IPC1-7): H04R19/04; C09J1/00; C09J11/04; C09J201/00; H04R1/04; H04R1/40; H04R31/00
Attorney, Agent or Firm:
Ariga Gunichiro
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