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Patent Searching and Data


Title:
SPECIAL ENVELOP LETTER
Document Type and Number:
Japanese Patent JPH07329456
Kind Code:
A
Abstract:

PURPOSE: To provide a special envelop letter achieved in cost reduction and made usable in the output of a word processor or a copier and widened in its entry effective area of the contents of a letter by making the shape of letter paper rectangular.

CONSTITUTION: In a special envelop letter wherein upper and lower pieces are connected through the horizontal fold lines (a), (b) parallelly provided to the upper and lower parts of rectangular paper 10 and an address surface 11, a sender surface 12 and an entry surface 13 are successively provided to the right end part of the paper 10 side by side through a folding-back piece and vertical fold lines (c), (d), (e), necessary items such as the contents of a letter are entered in the upper and rear surfaces of the envelop letter and, thereafter, the upper and lower pieces are folded toward the rear surface along the horizontal fold lines (a), (b) and the entry surface 13 and the sender surface 12 are successively folded toward the rear surface along the vertical fold lines (d), (e) and the folding-back piece is further folded toward the rear surface along the vertical fold line (c) to form an envelop having an almost square shape.


Inventors:
KENMOKU SATOSHI
TSUGIMURA KAZUYOSHI
WATANABE KAZUHIRO
SHIBAYAMA HIROYUKI
NAKAMUTA HIROYUKI
HIROSE MAKOTO
Application Number:
JP13202994A
Publication Date:
December 19, 1995
Filing Date:
June 14, 1994
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B42D15/02; B65D27/00; (IPC1-7): B42D15/02; B65D27/00