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Patent Searching and Data


Title:
SPECIAL ENVELOP LETTER
Document Type and Number:
Japanese Patent JPH07329458
Kind Code:
A
Abstract:

PURPOSE: To provide a special envelop letter achieved in cost reduction and made usable in the output of a word processor or a copier and widened in its entry effective area of the contents of a letter by making the shape of letter paper rectangular.

CONSTITUTION: A side surface bonding part 15, side surface pieces (d), (d) having a third fold line (c) provided to the center thereof, an address surface 11, the sender surface 12 connected to the address surface through a second fold line (b) and the entry surface 13 connected to the sender surface 12 through a first fold line (a) are successively provided to rectangular paper 10 side by side and an upper bonding part 16 is provided to the upper end part of the paper 10 and a lower bonding part 17 is provided to the lower end part thereof to constitute a special envelop letter. After necessary items such as the contents of a letter are entered in the upper and rear surfaces of the envelop letter, the envelop letter is successively folded toward the rear surface thereof along the first, second and third fold lines (a), (b), (c) and the upper and lower bonding parts 16, 17 are mutually bonded and the side surface bonding part 15 is bonded to the end part of the sender surface 12 to seal the envelop letter.


Inventors:
NAKAMUTA HIROYUKI
TSUGIMURA KAZUYOSHI
WATANABE KAZUHIRO
SHIBAYAMA HIROYUKI
HIROSE MAKOTO
KENMOKU SATOSHI
Application Number:
JP12790894A
Publication Date:
December 19, 1995
Filing Date:
June 09, 1994
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B42D15/02; B65D27/00; (IPC1-7): B42D15/02; B65D27/00