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Patent Searching and Data


Title:
SPECIMEN FILLING METHOD, CHIP KIT, CENTRIFUGE, AND MICROFLUID CHIP
Document Type and Number:
Japanese Patent JP2011174736
Kind Code:
A
Abstract:

To provide a specimen filling method that facilitates dispensing a small amount of a specimen by a reduced number of processes.

The specimen filling method is configured to fill the well of a microfluid chip containing a substrate, which has a first surface and to which a reservoir and a well region are provided and the well having an opening on the side of the first surface is formed, and the cover laid on the side of the first surface of the substrate and having a fixing region, with the specimen. The method includes a step of supplying the specimen to the reservoir, a step of arranging a crimp plate on the surface opposite to the substrate of the cover, a step of arranging the microfluid chip and the crimp plate to a centrifuge so that the well region is arranged outside the reservoir with respect to the rotary shaft of the centrifuge and the microfluid chip is arranged outside the crimp plate with respect to the rotary shaft of the centrifuge and a step of applying centrifugal force to the microfluid chip and the crimp plate by operating the centrifuge.


Inventors:
SAITO YUJI
Application Number:
JP2010037314A
Publication Date:
September 08, 2011
Filing Date:
February 23, 2010
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G01N35/00; B01J19/00; G01N1/00; G01N35/10; G01N37/00
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Misa Nagata