Title:
球状半導体装置
Document Type and Number:
Japanese Patent JP4070176
Kind Code:
B2
Abstract:
A spherical semiconductor device 1a comprises three spherical semiconductors 10, 20 and 30, which are connected together. An electronic circuit is formed on the surface of the central spherical semiconductor 10, among the three spherical semiconductors, while a coil 21 and a capacitor 31 are formed on the respective surfaces of the other spherical semiconductors 20 and 30, respectively. Since the spherical semiconductors 20 and 30 at the opposite ends are independent of the central spherical semiconductor 10, an insulating film on the coil 21 never influences the properties of the electronic circuit of the central spherical semiconductor 10, and the capacitor 31 can secure a capacity large enough to maintain satisfactory operating power for the spherical semiconductor device 1a. Since the three spherical semiconductors 10, 20 and 30 are manufactured in different processes, moreover, the productivity of the spherical semiconductors cannot be lowered by differences between manufacturing processes.
Inventors:
Ikuo Nishimoto
Shiro Kano
Shigeo Miyagawa
Shiro Kano
Shigeo Miyagawa
Application Number:
JP2000367069A
Publication Date:
April 02, 2008
Filing Date:
December 01, 2000
Export Citation:
Assignee:
YAMATAKE CORPORATION
International Classes:
H01L25/00; H01L27/00; H01L21/02; H01L21/822; H01L25/065; H01L25/07; H01L25/18; H01L27/04; H01L27/08; H01L29/06
Attorney, Agent or Firm:
Koji Nagato