To provide a spherical surface grinding method and a spherical surface grinding device capable of shortening a processing time in following processes and further reducing the number of processes by improving a quality requirement, specifically the depth of crack without reducing a processing efficiency so as to reduce a load on a precise grinding and a polishing in the following processes.
This spherical surface grinding method includes a speed-controlled slitting step of grinding a workpiece only a predetermined depth of cut by a grinding wheel while controlling a slitting speed by mutually approaching a workpiece shaft at the distal end of which a lens base is attached and a grinding wheel shaft at the distal end of which the grinding wheel is attached while rotating these shafts, and a pressure-controlled slitting step of slitting the workpiece while controlling a pressure at which the workpiece is pressed against the grinding wheel after the speed-controlled slitting step.
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