PURPOSE: To make the thickness of an applied film on the surface of a wafer uniform by appropriately heating the required part of the wafer which is held with a vacuum chuck.

CONSTITUTION: A vacuum chuck 1 is rotated at several thousand r.p.m. with a motor with the vertical axial center as the rotary center. The vacuum chuck 1 sucks the rear of a wafer 2 such as a silicon wafer and holds the wafer horizontally. The vacuum chuck 1 is surrounded with a spin cup 3. A nozzle 4 for dropping photoresist and developing liquid is arranged at the central part of the surface of the wafer 2 that is held with the vacuum chuck 1. A heater 5 having a fan for heating the peripheral part of said wafer 2 is arranged in a ring shape in the spin cup 3.