To provide a spin process support pin wherein contamination due to a remaining process liquid is prevented when a semiconductor wafer is spin- processed.

A support pin 21 is for spin process for holding a substrate which is processed in a process liquid provided at a rotating body which is rotated, and comprises a main body part 22, a first tapered surface 23 which is vertically tilted at the main body part and supports the peripheral part of the substrate, a protruding part 24 which is provided at the top of the first tapered surface and holds the peripheral part of the substrate when it is raised along the first tapered surface by eccentric rotation of the support pin, and a gas guiding hole 26 which is, as a removal means, formed at the main body part and removes the process liquid coming into between the first tapered surface and the lower surface of the peripheral part of the substrate.