To prevent the generation of static electricity and to prevent a material to be cleaned from being charged by grounding a cleaning water ejecting means.
Cleaning water is ejected against a semiconductor wafer from a cleaning water discharged part 26 disposed at the tip of the cleaning water ejecting means 22 of a spinner cleaner 20. When the cleaning water passes through a nozzle arm 27 and the cleaning water discharge part 26, static electricity happens to generate by the friction between the cleaning water and the respective inner walls. Accordingly, the nozzle arm 27 and cleaning water discharge part 26 are formed with a high electric conductivity member, the nozzle arm 27 is connected to the earthing line 28, and the cleaning water discharge part 26 is also grounded. Consequently, even if static electricity is generated, the static electricity is mostly leaked to the ground, the semiconductor wafer is never electrostatically charged, and the quality of the individual chip is not deteriorated.