Title:
SPINNING DEVICE AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2021109224
Kind Code:
A
Abstract:
To provide a spinning device and a molding method, allowing for accurate molding of a thick-walled portion where a placoid portion has increased thickness.SOLUTION: A spinning device 1 comprises: a support portion supporting a base material 9 having a an initial thickness t0; a first molding unit pressurizing the base material 9 while it is supported by the support portion, thereby molding the base material 9 in such a manner that the thickness of the base material 9 is increased from the initial thickness t0 to primary thickness t0 larger than the initial thickness t0; and a second molding unit 5 pressurizing the base material 9, thereby molding the base material 9 in such a manner that the thickness of the base material 9 is increased from the primary thickness t1 to a secondary thickness t2 larger than the initial thickness t0 and equal to or less than the primary thickness t1.SELECTED DRAWING: Figure 6
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Inventors:
HIGAKI KOJI
Application Number:
JP2020004608A
Publication Date:
August 02, 2021
Filing Date:
January 15, 2020
Export Citation:
Assignee:
NIPPON SPINDLE MFG CO LTD
International Classes:
B21H1/00; B21H1/02
Attorney, Agent or Firm:
Shinji Komai
Inoue Akifumi
Inoue Akifumi