To provide a spiral inductor having a small coupling (capacitance) with a substrate and capable of improving performance of an overall circuit, and to provide a method for manufacturing a semiconductor integrated circuit device having the same.

The spiral inductor 10 comprises a substrate 1, spiral line conductive layers 5 and 7 formed on the substrate 1 and to form a induction element. The inductor 10 further comprises a groove for isolating elements on the surface of the substrate 1, so as to form a protrusion to obtain a dummy element region 12 to control a CMP step on the upper surface on a region except the region directly under the layers 5 and 7.