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Title:
SPRING DEVICE
Document Type and Number:
Japanese Patent JP2007255539
Kind Code:
A
Abstract:

To provide an inexpensively manufacturable spring device capable of preventing mutual contact of arm parts even when many plate springs are overlapped and reducing thickness of the whole device.

A plurality of plate springs 5 having an outer peripheral part 8, a central part 9, and a plurality of arm parts 10 for connecting them, constituted integrally, and having the same shape are overlapped to constitute a vibration absorbing unit 4 as the spring device. Thickness X of the arm part 10 of the plate spring 5 is formed to be smaller than an interval Y between these arm parts 10. The plurality of plate springs 5 are overlapped by shifting them from each other around an axis Z being the direction of amplitude so that the arm parts 10 of adjacent plate springs 5 do not interfere mutually and are bent between the arm parts 10 of adjacent plate springs 5 when the arm parts 10 of the plate springs 5 are bent to prevent the arm part 10 of the plate spring 5 from coming into contact with the arm part 10 of adjacent plate spring 5 without using a spacer.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
URASAWA HIDETO
SAITO MAMORU
Application Number:
JP2006079653A
Publication Date:
October 04, 2007
Filing Date:
March 22, 2006
Export Citation:
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Assignee:
TSUIN BADO KOGYO KK
International Classes:
F16F3/02; F16F1/18
Domestic Patent References:
JPH0475245U1992-06-30
JPH0567838U1993-09-10
JP2000232699A2000-08-22
JP2001304316A2001-10-31



 
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