Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP2018009247
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sputtering device in which a long-sized film substrate withdrawn from a film deposition roll and sent to a downstream side conveyance roll is not deformed by sudden cooling.SOLUTION: A sputtering device 10 has a constitution including a vacuum chamber 14, a film deposition roll 18, a target material 20, a gas feed mechanism 24, three driving rolls (downstream side conveyance rolls) 26(1), 26(2), 26(3), and three temperature control mechanisms 30(1), 30(2), 30(3) for maintaining a temperature of each driving rolls 26(1), 26(2), 26(3), approximately constantly, at 80°C or lower and in a range higher than the lowest temperature in the vacuum chamber 14.SELECTED DRAWING: Figure 1
Inventors:
NASHIKI TOMOTAKE
HAMADA AKIRA
HAMADA AKIRA
Application Number:
JP2017148035A
Publication Date:
January 18, 2018
Filing Date:
July 31, 2017
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C23C14/34; C23C14/56
Domestic Patent References:
| JP2013049876A | 2013-03-14 | |||
| JPH11350117A | 1999-12-21 | |||
| JPH0428872A | 1992-01-31 | |||
| JP2010280943A | 2010-12-16 | |||
| JPH05131270A | 1993-05-28 | |||
| JP2010007142A | 2010-01-14 |
Attorney, Agent or Firm:
Takayoshi Kusumoto
Satoshi Mikumo
Satoshi Mikumo