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Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP2019183209
Kind Code:
A
Abstract:
To provide a sputtering device capable of suppressing water adsorption for a tray.SOLUTION: A sputtering device comprises: an atmospheric region 11 which is open to the atmosphere; a sputtering chamber 12 which is reduced in pressure as compared with the atmospheric pressure, and in which a transparent conductive film is formed principally of indium oxide on an object S of film deposition fitted to a tray T; and a carry-out/in chamber 13 which is connected to the sputtering chamber 12 and has an open state to the atmosphere and a pressure-reduced state compared with the atmospheric pressure, and from which the tray T fitted with the object S of film deposition before film deposition is carried into the sputtering chamber 12 and into which the tray T fitted with the object S of film deposition after the film deposition is carried out of the sputtering chamber 12. The carry-out/in chamber 13 between the atmospheric region 11 and carry-out/in chamber 13 constitutes a tray carry chamber in which the tray T is carried, the tray carry chamber comprises a heating part for heating the tray T, and the heating part heats the tray so that the tray T is held at a temperature of 60°C or higher outside the sputtering chamber.SELECTED DRAWING: Figure 1

Inventors:
MATSUZAKI JUNSUKE
Application Number:
JP2018073270A
Publication Date:
October 24, 2019
Filing Date:
April 05, 2018
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/34; C23C14/00; C23C14/08; C23C14/56; H01B13/00
Domestic Patent References:
JP2009149945A2009-07-09
JP2001059157A2001-03-06
JPS60110874A1985-06-17
JP2008276974A2008-11-13
Foreign References:
WO2009028595A12009-03-05
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda