To provide a sputtering apparatus and a method for sputtering a material from a target onto a substrate via the sputtering apparatus, which achieve high target utilization and more even distribution of the region of the target utilized for deposition on the substrate.
The sputtering apparatus 1 includes a sputtering target 2 with a glow discharge plasma formed thereon during sputtering. The sputtering target is disposed in a plane, with a front of the plane 6 defined as the side on which the glow discharge plasma is located during sputtering and a back of the plane defined as the opposite side. The sputtering apparatus also includes a magnetic circuit with an electrically floating center pole 18 and an electrically floating outside pole 20. Both the center pole and outside pole are at least partially disposed on the front side of the plane defined by the sputtering target.
HARTSOUGH LARRY D
| JPH10226878A | 1998-08-25 | |||
| JPH03257161A | 1991-11-15 | |||
| JPS62214171A | 1987-09-19 | |||
| JPS6233766A | 1987-02-13 | |||
| JPS60138070A | 1985-07-22 | |||
| JPS6365072A | 1988-03-23 | |||
| JPH02243761A | 1990-09-27 | |||
| JPH11323548A | 1999-11-26 | |||
| JPH02182879A | 1990-07-17 |
Jun Tsuruta
Yoshio Mizutani
Kei Mori
Next Patent: PROTECTIVE TUBE FOR THERMOCOUPLE