To provide a sputtering apparatus enabling uniform deposition to a substrate.

A sputtering apparatus 1 includes a rotating device 4 that rotates a convex lens 10, a first target 5 that has a first material emission surface 50 and a first magnet pair 51 mutually different in polarity, and a second target 6 that has a second material emission surface 60 and a second magnet pair 61 mutually different in polarity, wherein the first target 5 has the first material emission surface 50 disposed in parallel to a rotary shaft 41, the second target 6 has the second material emission surface 60 disposed in parallel to the rotary shaft 41, the first magnet pair 51 is disposed to the first target 5 so that a first normal line 55 in a first intermediate point 54 passes the other side from the bottom 10b as to the top part 10a of the convex lens 10, and the second magnet pair 61 is disposed to the second target 6 so that a second normal line 65 in a second intermediate point 64 passes between the top part 10a and the bottom 10b of the convex lens 10.